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Posted : April 24, 2013 Contact suppliers in this article Share: Facebook Twitter Google Linkedin | Print E-mailQuestion? Chat
The Gly-a-131 model from G-Fly uses a 2-layer PCB with an FR-4 base and lead-free HASL surface finish. It is UL-listed.
China’s PCB assembly industry continues to grow at a fast pace, with companies broadening upscale selections and boosting manufacturing capacity while exploring new applications. They are leveraging the country’s majority output share in the strong mobile phone, computer, LED and automotive markets to advance the segment. China is responsible for 70 percent of the global yield of handsets, more than 50 percent of tablet PCs, 30 percent of diode-based products and 50 percent of vehicle relays. In the third category, it has overtaken Japan and South Korea.
To upgrade the line, a rising number of businesses are using HDI and 12 to 32-layer PCBs, and IC substrates. Most products are currently based on single- or double-sided boards or units with fewer than 12 layers.
State-owned maker Shennan turns out 58-layer assemblies on a mass scale, and can provide samples utilizing up to 64 tiers. The company will start making IC substrates and corresponding assemblies in its 240,000sqm factory in Wuxi, Jiangsu province in 2014. Fato, a key player in PCB assemblies for telecom applications, will offer HDI boards and assemblies for mobile phones. It is constructing a facility in Chongqing municipality, which will enable the supplier to handle 25,000 to 30,000sqm each month by year-end.
To achieve compact designs, manufacturers such as Shenzhen Leadsin Technology Co. Ltd employ encapsulation plates, soft boards, and 0402, 0201 and 01005 SMD components.
Automotive PCB assembly specialist Zhejiang Zapon Electronic Technology Co. Ltd will release more 4 to 12-layer variants for laptops and mobile phones, and models utilizing aluminum boards for LED lamps.
Shenzhen Leadsin has developed units for RF remote controllers used in smart homes, targeting requirement in Europe and North America. The maker is confident the emerging category will raise its sales by 30 to 40 percent in the months ahead.
Complementing product enhancements, Shenzhen Leadsin will invest $500,000 this year in three Juki SMT lines to add to the existing six, which also came from Japan. Once installed, its overall capacity will increase by 50 percent to 15,000 units daily. Zhejiang Zapon will continue to allocate 15 percent of annual sales for facility expansion.
For greater competitiveness, suppliers will strengthen capability to provide additional services. Shenzhen Leadsin and G-Fly Technology Co. Ltd offer material and component sourcing as well.
Shorter turnaround is also emphasized. G-Fly ensures custom single- and double-sided PCB assemblysamples are ready in 24hr, and 2 to 10-layer versions in three days. Shenzhen Leadsin can complete prototypes based on 4 to 20-layer boards in two to 12 days. The company has a 24hr service for customers and requires no minimum order quantity.
Mainland China remains the world’s largest production base of PCB assemblies, accounting for 40 percent of sales. In 2012, the local PCB and assembly industry posted $20 billion in revenue, with $14 billion from exports exceeding 29 billion units. Outbound volume is expected to climb by 10 percent this year. Hong Kong, Taiwan, South Korea, Japan and Southeast Asia are the key destinations.
In terms of output value, the mainland sector is projected to keep a CAGR of 8 percent in 2010-15, exceeding the 5 percent global average, according to Prismark.
To sustain this momentum, the government lends support through financial subsidies. Nationwide tax incentives took effect in May last year, with reductions ranging from 25 to 100 percent for qualified PCB assembly suppliers. There is also funding at provincial level. Jiangxi, an emerging manufacturing area, has been allotting $10 million annually to the industry since 2010.
There are more than 1,000 mainland makers in the line. Seventy percent of the pool consists of private businesses, 25 percent foreign-invested operations and the rest state-owned companies.
The Yangtze River Delta region and Guangdong province are the key production centers, churning out more than 60 percent of the mainland’s yield. Developing hubs Jiangxi, Hubei, Shaanxi and Sichuan provinces, and Chongqing municipality have a combined 20 percent share. More enterprises are setting up operations in these inland locations.
Single-, double-sided and multilayer types dominate the range in China with output share surpassing 80 percent. Flexible, rigid-flex, HDI PCB and IC substrate assemblies make up the rest of the selection.
Aside from terminal electronic products, makers cater to requirements in household appliances, medical and industrial equipment, precision instruments and meters, power modules and traffic control boards. They also provide PCB assemblies for aeronautical and aerospace applications.
SO, SOP, SOJ, DIP, PLCC, PQFP, TQFP, TSOP, TSSOP, QFP, BGA and U-BGA kinds constitute the options. These can have up to ±0.1mm chip placement precision, and 3 and 3.9mil minimum line widths on inner and outer layers, respectively. The smallest hole size is 0.075mm, while copper thickness ranges from 0.5 to 6oz. Boards can exceed 1,100x550mm.
HASL and its lead-free variant, immersion gold, gold plating, gold finger, immersion silver and tin, and OSP are the typical surface finishes used. For solder masks, green, yellow, black, white, red and blue are available.
PCBs, electronic components, scaling powder, soldering paste, copper, tin and mucilage are the main inputs.
About two-thirds of the suppliers produce the boards in-house, with the rest outsourcing to local providers. For high-end models, manufacturers adopt PCBs from Taiwan, South Korea or Japan. They obtain the other materials and components from domestic companies, importing on request only. Solder mask may be purchased from GreenCure and dry film from DuPont.
Prices will remain stable in the months ahead. Latest releases may have higher quotes by 5 to 10 percent.
Taiwan PCB assembly suppliers are releasing more units using HDI boards, driven by the trend for thin forms in the smartphone and tablet PC application sectors. They adopt component embedded technology to meet the compact requirement further, realizing 0402 and 0201 kinds. Companies also have cavity and embossed variants.
Manufacturers employ SMT and through-hole methods, turning out IVH/BVH, build-up, flexible, rigid, rigid- ex and COB types. They utilize mainly FR-4 base materials for rigid types, and polyimide for flexible variants. High-Tg kinds of the first input, Rogers, aluminum, Teflon and Arlon are the other options.
By surface finish, the choices are lead-free HAL and HASL, ENIG, OSP, immersion silver, gold and tin, and electrolytic gold.
Products target mainly the semiconductor, telecom, consumer and automotive electronics, and computer segments.
Companies have in-house capability for various processes, including functional, short-circuit and application testing. They are also equipped with facilities for injection molding of metal, plastic and rubber parts, and can provide layout design, in addition to bare PCBs. Production is done in Taiwan and mainland China.
Related reports:Aluminum PCBs: Makers highlight improved thermal conductivityFlexible PCBs: Makers emphasize higher-density unitsHDI PCBs: R&D, production accelerate in Taiwan
Model: Paging AmplifierMOQ: 500 unitsDelivery: 14 daysDescription: For IP-based overhead paging systems; 6-layer PCB; Tg>170 FR-4 base; 2μin immersion gold surface finish
Model: Industrial Control BoardMOQ: NegotiableDescription: For electronic instruments, maintenance and measurement equipment; 1 to 4-layer PCB; FR-4 base; green solder mask; white silk-screening; SMT, DIP; 1.6mm board thickness
Model: PCBA-SDescription: For 3-speed air blowers, air curtains, lighting control; on/off switch; connection with RF remote control module, cooking utensils supported
Model: Leadsintec-001MOQ: 100 unitsDelivery: 30 daysDescription: For smart home controllers; 8-layer PCB; immersion gold surface finish; fine-pitch IC, BGA, 0201, 0402 parts; 80x100mm; CE, FCC, UL
Model: PCBA-05Description: Single- or multilayer PCB; layout and relayout; SMT, BGA, DIP; in-circuit, functional tests; aftersales service; OEM/ODM orders accepted
Model: Control Base StationDescription: For medical monitoring systems; 4-layer rigid PCB; SMT, turnkey assembly
Model: ZP PCBA 201301MOQ: 1 unitDelivery: 20 daysDescription: For electronic devices; 4-layer PCB; lead-free HAL surface finish; 100x200mm; UL, TS 16949, H26
Note: All price quotes in this report are in US dollars unless otherwise specified. FOB prices were provided by the companies interviewed only as reference prices at the time of interview and may have changed.
Disclaimer: All product images are provided by the companies interviewed and are for reference purposes only. Those product images featuring products with trademarks, brand names or logos are not intended for sale. We, our affiliates, and our affiliates' respective directors, officers, employees, representatives, agents or contractors, do not accept and will not have any responsibility or liability for product images (or any part thereof) which infringe on any intellectual property or other rights of a third party.
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